| 摘要 |
PURPOSE:To contrive improvement in uniformity of planar dimensional distribution by a method wherein developer in a developing vessel is circulated by a pump while dipping and developing operation is conducted. CONSTITUTION:A wafer 6 is sucked by a vacuum chuck 8 and it is fixed to the central part of a developing vessel 7 of a device, the inner wall 9 of the developing vessel 7 is provided on the circumference of the vacuum chuck 8, and an O-ring 10 is attached to the upper part of the inner wall 9. When the wafer 6 in sucked downward through the vacuum chuck 8, the O-ring 10 shrinks a little, and the leakage of developer 11 through a gap between the wafer 6 and the inner wall 9 is prevented. The developer 11 is continuously circulated, by means of a circulation pump 12, through the developing vessel 7 and the circulation pipe 14 attached to the outer wall 13 of the developing vessel 7 during developing operation. Besides, straightening plates 15 are attached with same interval in front and rear of the wafer 6 in the circulating direction of the developer 11 so that the developer will be circulated on the wafer in a uniform laminar flow. As a result, the uniformity of the roughness and fineness of the pattern generated by developing and the planar dimensions can be improved. |
