Printed circuit board design for multiple versions of integrated circuit device

摘要

A printed circuit board design capable of accepting both first and second versions of an IC device. First and second IC devices (10, 20) have pins disposed along respective first and second rectangular peripheries (12a-b and 15a-b; 22a-b and 23a-b). Each pin on the first IC device has a functional counterpart pin on the second IC device. The board configuration contains pads in first and second arrays (32a-b and 35a-b; 32a, 32c, 33a-b) that correspond to the pins on the first and second IC devices. At least some of the pads (32b) of the first array do not physically coincide with pads in the second array and are located within the rectangle defined by the second array. Each non-overlapping pad in the first array is connected by a circuit board trace (40) to a respective pad in the second array such that each circuit board trace joins two pads corresponding to counterpart pins.