发明名称 MOISTURE PROOF AGENT APPLICATION METHOD FOR JOINTS OF PRINTED CIRCUIT BOARD, AND CONNECTOR AND TERMINAL SECURED THERETO
摘要 PROBLEM TO BE SOLVED: To properly apply a moisture proof agent to the joints of a printed circuit board and each connector terminal via a simple work. SOLUTION: A moisture proof agent application member such as a restriction plate 16 is secured to a connector housing 12, and a terminal 14 led out from the connector housing 12 is vertically passed through each through-hole 18 of the restriction plate 16. A recess 20 as a pocket for a moisture proof agent is formed on the upper surface of the restriction plate, so as to cover each through-hole 18. Then, the moisture proof agent is fed to the recess 20, and the agent deposited therein is made to flow down along the surface of each terminal 14 from each through-hole 18 to the joint of the concerned terminal 14 and the printed circuit board, thereby applying the moisture proof agent to the joints.
申请公布号 JPH09129289(A) 申请公布日期 1997.05.16
申请号 JP19950285397 申请日期 1995.11.01
申请人 HARNESS SOGO GIJUTSU KENKYUSHO:KK;SUMITOMO WIRING SYST LTD;SUMITOMO ELECTRIC IND LTD 发明人 OKAMURA NORITOMO;TANAKA TETSUJI;NOZAKI TAKAO
分类号 H01R43/00;H01R12/04;H05K3/28;H05K3/34;(IPC1-7):H01R9/09 主分类号 H01R43/00
代理机构 代理人
主权项
地址