| 摘要 |
PROBLEM TO BE SOLVED: To increase the number of outer leads. SOLUTION: The resin-sealing substance 26 of a QFP.IC 29 molded by a transfer molding apparatus having a chamfered part forming part for forming a chamfered part 45 at one corner part of its upper or lower mold with a cavity in the mating surface for forming a resin-sealing substance 26, and having a long gate provided in the direction of the thickness of the cavity in this chamfered part forming part, has a chamfered part 45 at its one corner part. In the chamfered part 45 a longitudinally long gate scar 46 is formed, and the number of outer leads increases by the extent of the decrease of the width of the chamfered part 45. Accordingly, it becomes possible to infect resin into the cavity sufficiently even if the width of the longitudinally long gate is small. On the other hand, it become possible to reduce the width of the chamfered part forming part because of the reduction of the gate width, and to lengthen the length of one side of the resin sealing substance 26 to that extent and increase the number of outer leads. |
