SEMICONDUCTOR COMPONENT AND ITS MANUFACTURE

摘要

PROBLEM TO BE SOLVED: To improve connection reliability by preventing the generation of cracks in a solder ball terminal part formed on the rear of a board. SOLUTION: A semiconductor chip 23 is mounted on the surface of a board 22 made of ceramics and connected with a surface electrode by using bonding wires 24. Resin sealing is performed by using a sealing resin 25 composed of epoxy resin. A solder ball terminal 26 is formed on each rear electrode on the rear side of the board 22. A synthetic resin layer 27 composed of epoxy resin is formed such that at least a part of the solder ball type terminal 26 embedded. The thickness of the synthetic resin layer 27 is made at least 50 μm and less than or equal to one half of the height of the solder ball type terminal 26. The synthetic resin layer 27 is formed by, e.g. a drip method using a dispenser.