| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device for increasing the number of connection terminals and for reducing package size. SOLUTION: A wiring substrate 50 is jointed to the counter metal plate side of a package body 30 with a metal plate 10 and a printed wiring board 20 by a relay terminal 40 a, and an input/output terminal 54 that is provided at the counter package body side of the wiring board 50 is connected electrically to an electrode part 71 of a semiconductor element 70 via a bonding wire 80, a wiring layer 22, and a relay terminal 40. As a result, the input/output terminal 54 can be arranged also directly below a cavity part 60 of the package body 30. By arranging the input/output terminal 54 on the entire surface of the lower surface of the package body 30, the number of terminals to be connected to a printed circuit board(PCB) 200 can be increased, thus mounting highly dense semiconductor elements and increasing speed and further increasing the latitude in designing a semiconductor device and reducing a package size. |
