SEMICONDUCTOR WAFER PROCESSING APPARATUS

摘要

In the wafer feed gear having a loading part having an accumulation of wafers and an unloading part formed on its right, for conveying a wafer transferred from a carrier along a center line provided between the loading part and the unloading part by using an up/down guide, to a boat by a progressive/backward operation of a main gripper, the wafer feed gear includes an additional installment of a selection type gripper on the main gripper so as to enable to execute a selective loading/unloading of the wafer, thereby remarkably reducing a time taken in a P/R hardening and preventing an inferior phenomenon such as a scratch or dust occurrence.