| 摘要 |
A power semiconductor module has semiconductor tablets (4) on a baseplate (2) to which connection elements (6,10) are fixed inside an electrically insulating housing (1). The connections are secured against movement in the direction of the baseplate. A power semiconductor module comprises semiconductor tablets (4) on a baseplate (2) to which connection elements (6,10) are fixed inside an electrically insulating housing (1) perpendicularly to the plane of the baseplate. The connections comprise buffer faces parallel to the baseplate which ensure, by the mounting of the module parallel to the baseplate, that the connections are secured against movement in the direction of the baseplate. |
