| 摘要 |
PROBLEM TO BE SOLVED: To provide a socket enabled to correspond with an IC package with fine pitch. SOLUTION: The socket 10 comprises a base 11 to which, a plurality of contacts 13 having an arm 13a enabled to touch a solder ball of the package, are arranged, a loading part 12a on which the package is loaded, plurality of ball locking surfaces arranged on the loading part 12a so as to be locked into the solder balls, a plurality of contact housing holes 12d arranged so as to house contacts 13 of base 11 side, and a slider to which the ball locking surface and the contact housing hole 12d are arranged in paired state in X direction, enabled to move in X direction.
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