发明名称 Process for reforming surface of substrate, reformed substrate and apparatus for the same
摘要 Sputtering particles are deposited immediately after activating a surface of a substrate composed of a carbon-containing material. Accordingly, a process for reforming a surface of a substrate, a substrate with a reformed surface, and an apparatus therefor are provided in which the depositability and adhesiveness of the sputtering particles are improved. A vacuum ultraviolet light is generated by a laser beam. A surface of a substrate composed of a carbon-containing material is exposed to the generated vacuum ultraviolet light. As a result, the surface of the substrate is activated. Simultaneously therewith, a sputtering particles-generating device generates sputtering particles, such as neutral atoms, ions and clusters. The resultant sputtering particles are deposited on the activated surface of the substrate. Since the sputtering particles are deposited immediately after the surface of the substrate is activated, they are adhered firmly on the surface of the substrate.
申请公布号 US6858115(B2) 申请公布日期 2005.02.22
申请号 US20030387466 申请日期 2003.03.14
申请人 KABUSHIKI KAISHA TOYOTA CHUO KENKYUSHO 发明人 AZUMA HIROZUMI;TAKEUCHI AKIHIRO;MATSUOKA TAKAAKI;TACHI KAZUYUKI;KAMIYA NOBUO
分类号 C08J7/06;C23C14/02;C23C14/22;C23C14/28;C23C14/34;(IPC1-7):C23C14/34 主分类号 C08J7/06
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