| 摘要 |
In a method of forming a device so as to include a reflective surface at a specific angle to an incident optical axis, a region of a first major surface of a substrate is exposed to an anisotropic etchant to form a surface having the specific angle with respect to the first major surface, but the etched surface is then used as a mounting surface. That is, rather than anisotropically etching a reflective surface, the etching provides the mounting surface and the second major surface of the substrate functions as the reflective surface when the fabricated device is properly mounted. The substrate may be a <100> silicon wafer having a 9.74 degree off-axis cut. Then, a 45 degree mirror is formed by the process. When the reflector is used in an optical device, the <111> crystalline plane will be generally parallel to the surface of the support.
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