| 摘要 |
<p>There is provided a method for manufacturing a substrate with a built-in component which enables to reduce the pitches between interlayer connection conductors and achieve the miniaturization of the substrate with the built-in component by forming the interlayer connection conductor with a small bore and high straightness in the substrate with the built-in component. There is also provided the substrate with the built-in component. In the substrate with the built-in component (40), a component (9) is embedded in a second layer (11) in the uncured state, and a resin layer (11) is cured. After that, a hole (12) penetrating the second layer (11) in a vertical direction is formed, and the hole (12) is filled with a conductive paste to form a second interlayer connection conductor (8). A first in-plane conductor (2) including a plurality of lands (2a), a first layer (6), and a second layer (11) are successively laminated, crimped, and heated. Thereby, the first layer (6) is cured, and an integrated structure is formed.</p> |
