发明名称 DISPLAY PANEL
摘要 A display panel is provided. The display panel includes a substrate including a non-display region containing a thin film transistor, which includes a semiconductor layer; a first insulating layer; a first metal layer; a second insulating layer; a first and second via hole series disposed adjacent to the respective opposite sides of the first metal layer. The first via hole series includes a plurality of first via holes, and the second via hole series includes a plurality of second via holes. A second metal layer includes a first portion and a second portion. The minimum distance between an edge of the first portion and an edge of the first metal layer is a first distance, and the minimum distance between an edge of the second portion and another edge of the first metal layer is a second distance, and the second distance is greater than the first distance.
申请公布号 US2016204124(A1) 申请公布日期 2016.07.14
申请号 US201514750170 申请日期 2015.06.25
申请人 InnoLux Corporation 发明人 YEN Chung-Wen;LIANG Hsing-Yi;LEE Te-Yu
分类号 H01L27/12;G02F1/1368;G02F1/1335;H01L27/32 主分类号 H01L27/12
代理机构 代理人
主权项 1. A display panel, comprising: a substrate comprising a display region and a non-display region adjacent to the display region; a thin film transistor disposed on the non-display region of the substrate, wherein the thin film transistor comprises: a semiconductor layer disposed over the substrate;a first insulating layer disposed over the semiconductor layer;a first metal layer disposed over the first insulating layer;a second insulating layer disposed over the first insulating layer;a first via hole series and a second via hole series disposed adjacent to respective opposite sides of the first metal layer, wherein the first via hole series comprises a plurality of first via holes, and the second via hole series comprises a plurality of second via holes, wherein the plurality of first via holes and the plurality of second via holes are defined by a sidewall of the first insulating layer, a sidewall of the second insulating layer, and a surface of the semiconductor layer;a second metal layer disposed over the second insulating layer, wherein the second metal layer comprises a first portion and a second portion, wherein the first portion electrically connects the semiconductor layer through the plurality of first via holes, and the second portion electrically connects the semiconductor layer through the plurality of second via holes,wherein a minimum distance between an edge of the first portion and an edge of the first metal layer is a first distance, and a minimum distance between an edge of the second portion and another edge of the first metal layer is a second distance, and the second distance is greater than the first distance.
地址 Miao-Li County TW