INVERTED OPTICAL DEVICE

摘要

Inverted optical device. In accordance with an embodiment of the present invention, a plurality of piggyback substrates are attached to a carrier wafer. The plurality of piggyback substrates are dissimilar in composition to the carrier wafer. The plurality of piggyback substrates are processed, while attached to the carrier wafer, to produce a plurality of integrated circuit devices. A flip wafer is attached to the plurality of light emitting diodes, away from the carrier wafer and the carrier wafer is removed. The plurality of light emitting diodes may be singulated to form individual light emitting diode devices.

主权项

1. An apparatus comprising:
a non-conducting substrate structure; a light emitting diode semiconductor structure having a pair of contact surfaces, wherein said pair of contact surfaces face said substrate structure; an insulating material coupling said light emitting diode semiconductor structure to said substrate structure.