MANUFACTURING METHOD OF LAMINATED PLATE AND MULTILAYER CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a laminated plate using an insulating film composed of a II type liquid crystal polymer, and suppress the occurrence of conduction failure between layers when a multilayer circuit board is formed.SOLUTION: There is provided a manufacturing method of a laminated plate obtained by laminating an insulating film composed of a II type liquid crystal polymer and a metal foil and used for manufacturing a multilayer circuit board, the method including: a drying step of heating the insulating film at temperatures of 120 to 250°C for 20 seconds or more before drying the insulating film; and a thermal compression bonding step of applying pressure to the dried insulating film and the metal foil at a pressure of 0.5 to 10 MPa for 10 to 600 seconds while heating at temperatures of 250 to 330°C to thermally bond the insulating film and the metal foil to form a laminated plate.SELECTED DRAWING: None