Temporary bonding adhesive for a semiconductor wafer and method for manufacturing a semiconductor device using the same

摘要

To provide a temporary bonding adhesive for a semiconductor wafer that reduces damage to a semiconductor wafer, makes it readily detachable, and can shorten the time required for thermal decomposition, and a manufacturing method for a semiconductor device using this.;A temporary bonding adhesive for a semiconductor wafer, being a temporary bonding adhesive used for temporarily bonding a semiconductor wafer onto a supporting substrate in order to process a semiconductor wafer, and for detaching a semiconductor wafer from a supporting substrate by heating after processing, containing a resin composition whereof the 50% weight loss temperature decreases after irradiation by active energy rays.

主权项

1. A temporary bonding adhesive for a semiconductor wafer, used for temporarily bonding a semiconductor wafer onto a supporting substrate in order to process a semiconductor wafer, and for detaching a semiconductor wafer from a supporting substrate by heating after processing, said temporary bonding adhesive containing:
a resin composition wherein a 50% weight loss temperature decreases after irradiation by active energy rays; and an activator that generates active species when energy is added by irradiation with said active energy rays, wherein the activator is a photo-acid generating agent, and the resin composition comprises at least one resin selected from the group consisting of polypropylene carbonate, polycyclohexylene carbonate, polybutylene carbonate, and polyneopentyl carbonate.