| 摘要 |
PROBLEM TO BE SOLVED: To easily and simultaneously position a plurality of articles, such as substrates, etc., with high accuracy by separately providing carriers having housing sections for separately housing the articles and positioning members for positioning the articles. SOLUTION: When a positioning plate 14 is lowered by means of cylinders 28 and 28, pins 30 and 30 provided on the plate 14 get in the holes of carriers 22 and position the carriers 22. Substrates 20 are inserted into positioning holes 12 while the substrates 20 are supported by contacting tables provided at the front end sections of placing sections 24 inserted into the holes 12. When the substrates 20 are inserted into the holes 12, the substrates 20 can be inserted into the positioning sections of the holes 12 through tapered surfaces even when the substrates 20 are more or less deviated from the positioning sections of the holes 12. Therefore, the manufacturing cost of a semiconductor device can be reduced, because a plurality of individually cut substrates for semiconductor device can be easily and simultaneously positioned with high accuracy and the carriers 22 can be formed through press work. |
