| 摘要 |
Disclosed is a moisture-crosslinking hot-melt adhesive which comprises: (1) a reaction product of: ¢A! a low molecular weight polyol having a molecular weight of from 500 to 10,000, ¢B! a diisocyanate, and ¢C! a hydroxyepoxide, and (2) an anhydride. The moisture-crosslinking hot-melt adhesive does not generate carbon dioxide during curing.
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