| 摘要 |
This invention provides a process and relating apparatus comprising at least one unit for gripping at least one microcomponent (41a, 41b, 41c) arranged at the top opening (55) of a magazine (52) containing the stacked microcomponents, then supplying the microcomponent to a preselected position of a printed circuit board (20). Each of the units comprises at least one gripping means (43, 44) for selectively withdrawing and supplying a single microcomponent (41a, 41b, 41c); a control member (49) for opening and closing said gripping means, a handling means for moving said gripping means (43, 44) from a position substantially corresponding to the top opening (52) of the stack of microcomponents to another position substantially corresponding to the application position for said microcomponent (41a, 41b, 41c) on said printed circuit board (20) and a means for feeding each of the microcomponent, inside the magazine by an amount corresponding to the thickness of the component therein retained.
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