A ball grid array integrated circuit package that has vias located within the solder pads

摘要

A ball grid array (BGA) integrated circuit package which has a plurality of vias located within the solder pads of a package substrate. The substrate supports an integrated circuit which is connected to the solder pads by the vias. Solder balls used to solder the package to an external printed circuit board are attached to the solder pads of the substrate. A solder mask plug is formed within the vias to prevent the solder balls from wicking into the vias. Locating the vias within the solder pads optimizes the routing space of the substrate and increases the routing density of the package.