发明名称 SUBSTRAT AYANT AU MOINS UNE COUCHE CONDUCTRICE FINE DE CABLAGE
摘要 A fine-wired conductor for use in LSI circuits exhibits good adhesion properties. The conductor is made up of a film of metal such as chrome or titanium on an insulator such as a ceramic substrate, a gold layer over the film of metal and a palladium film on the gold layer. In addition, a palladium layer can be interposed between the metal film and the gold layer to facilitate gold plating and inhibit diffusion of the metal and the gold.
申请公布号 FR2542502(B1) 申请公布日期 1986.09.26
申请号 FR19840003761 申请日期 1984.03.12
申请人 NEC CORP 发明人 TATSUO INOUE ET MITSURU KIMURA;KIMURA MITSURU
分类号 H05K3/46;H01B5/14;H01L23/498;H05K3/38;(IPC1-7):H01L29/14;H01L23/52 主分类号 H05K3/46
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