发明名称 |
SUBSTRAT AYANT AU MOINS UNE COUCHE CONDUCTRICE FINE DE CABLAGE |
摘要 |
A fine-wired conductor for use in LSI circuits exhibits good adhesion properties. The conductor is made up of a film of metal such as chrome or titanium on an insulator such as a ceramic substrate, a gold layer over the film of metal and a palladium film on the gold layer. In addition, a palladium layer can be interposed between the metal film and the gold layer to facilitate gold plating and inhibit diffusion of the metal and the gold. |
申请公布号 |
FR2542502(B1) |
申请公布日期 |
1986.09.26 |
申请号 |
FR19840003761 |
申请日期 |
1984.03.12 |
申请人 |
NEC CORP |
发明人 |
TATSUO INOUE ET MITSURU KIMURA;KIMURA MITSURU |
分类号 |
H05K3/46;H01B5/14;H01L23/498;H05K3/38;(IPC1-7):H01L29/14;H01L23/52 |
主分类号 |
H05K3/46 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|