发明名称 |
Plastics encapsulated electronic devices |
摘要 |
The plastic encapsulation material covering an integrated circuit is impregnated with a corrosion inhibitor evenly dispensed throughout the material. This inhibits the corrosion of the metallization on the surface of the integrated circuit thus prolonging the life of the device particularly under adverse environmental conditions.
|
申请公布号 |
US4614963(A) |
申请公布日期 |
1986.09.30 |
申请号 |
US19830552867 |
申请日期 |
1983.11.18 |
申请人 |
PLESSEY OVERSEAS LIMITED |
发明人 |
BRETTLE, JACK;GOOSEY, MARTIN T. |
分类号 |
H01G2/12;H01L23/29;H05K3/28;(IPC1-7):H01L23/30 |
主分类号 |
H01G2/12 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|