| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a uniform slurry layer on the entire surface of a polishing pad by rotating a substrate and polishing pad, pressing the pad to the substrate, and dispersing a slurry from a center port. SOLUTION: A polishing apparatus 80 has a table top 83 disposed above, the table top has a series of polishing stations 100a and 100c, each having a rotatable platen 110 with the pad 120 laid thereon. The pad 120 having a first diameter and substrate 10 having a second diameter less than that of the first one are rotated and substrate 10 is contacted with the pad 120 so that the center of the pad is aligned with that of the periphery of the substrate 10, thereby locating the substrate on the center of the pad 120 during polishing.</p> |
