| 摘要 |
<p>PURPOSE:To obtain a low-stress composition excellent in moldability, moisture resistance and cracking resistance after heat shock and useful for semiconductor sealing, comprising a specified silicone oil-modified epoxy resin. CONSTITUTION:A silicone oil-modified epoxy resin (D) is obtained by reacting an epoxy resin (a) (e.g., phenol novolak epoxy resin) with an amino group- terminated silicone oil (B) of the formula (wherein R1 is an alkyl such as methyl, ethyl or butyl or an alkylamino such as ethylamino or butylamino, n is 50-300, R2 is an alkylamino such as methylamino or butylamino and R3 is methyl or phenyl) at 100-200 deg.C for 2-4hr in the presence of an organophosphine (c) (e.g., octylphosphine). An epoxy resin (A) is mixed with a curing agent (B), a cure accelerator (C), 5wt% or below component D and, optionally, a filler, mold release, colorant and flame retardant (E).</p> |
