| 摘要 |
<p>This invention aims at providing a surface cleaning method and to constantly obtain cleaning agent ultraclean surfaces of a substrate while preventing reverse contamination due to the return of metal impurities from a cleaning agent to the substrate. The surface cleaning method for the substrate is characterized in that an oxidation-reduction potential of an aqueous solution (oxidation-reduction potential with respect to a hydrogen reference electrode; hereinafter the same) is controlled to be higher than the oxidation-reduction potential of impurity metals to be removed. The oxidation-reduction potential of the aqueous solution is preferably set to at least 0.6 V.</p> |
