发明名称 ELECTRONIC-PART MOUNTING APPARATUS
摘要 PROBLEM TO BE SOLVED: To control the amount of downward movement of operating means such as mounting means and applying means with respect to a wiring substrate with high precision by providing control means which calculates a drive amount for elevating means from data measured by measuring means and optimizes the amount of downward movement of the operating means, at every execution of a predetermined operation by the operating means. SOLUTION: A measurement device (measuring means) 70, which measures the distance from a mounting head 6 to an application position (part mounting position) on a wiring substrate in accordance with a non-contact method, is attached on the side of a fixing part of the mounting head 6. At every execution of application of soldering paste or mounting an electronic part by an operating device such as an applying member 25 and a mounting member, the measurement device 70 measures the distance from the mounting head 6 to the application position or mounting position. Then, the operation of an electric motor 61 is controlled based on the measured data. Accordingly, the amount of downward movement of the applying member 25 or the like is always optimized, thus, the descending amount is controlled with high precision.
申请公布号 JPH09214187(A) 申请公布日期 1997.08.15
申请号 JP19960012603 申请日期 1996.01.29
申请人 TECHNO KAPURA:KK 发明人 FUJIOKA TERUHIKO;OKAZAKI TADAO;MAEHARA YOSHIKAZU
分类号 H05K13/04 主分类号 H05K13/04
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