| 摘要 |
PROBLEM TO BE SOLVED: To provide a board on which bare chips and square electronic components can be mount in high density, circuit modules, and method for manufacturing circuit modules. SOLUTION: A bare chip 4 is mounted on a land 2 of a board 1. Electrodes 5 on the top of the bare chip 4 and pads 3 are connected with wires 6. Pads 3 are formed in a line opposing to the land 4. An electrode 10A for soldering electrodes 9 of square electronic components 8 in space between the lines of the pads 3. After solder jointing of the square electronic component 8, the bare chip 4 is implemented and sealed by resin 7. The resin 7 seals not only the bare chip 4 but also all or a part of the square electronic components 8 solder jointed between the lines of the pads 3. Since the square electronic components 8 are mounted in spaces between the lines of the pads 3, the bare chip 4 and the square electronic components 8 can be implemented in high density and the board can be small. |
