| 摘要 |
PROBLEM TO BE SOLVED: To enhance the mounting accuracy of a chip part together with productivity on chip part joint. SOLUTION: A chip part jointing apparatus comprises a stage 2 capable of registering a substrate 10 to be mounted a chip part 12 thereon with a solder piece 11, a light source 3 which is provided above the stage 2 for heating the chip part 12 on the to-be-mounted substrate 10 by irradiating light and to melt the solder piece 11, and a mounting arm 6 which is provided movably between the light source 3 and the stage 2 to mount and press the chip part 12 with respect to the solder piece 11 on the substrate 10 to be mounted, the mounting arm 6 being a transparent arm, through which beam S from the light source 3 can reach the chip part 12. |
