发明名称 POLISHING PROCESS METHOD OF COMPOUND MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a polishing method which can reduce the difference of processing level, and generates no metal attachment, when a member to be polished formed by combining different sorts of materials is polishing processed. SOLUTION: While abrasive particles 42 are fed on a polishing surface 14 to be the surface of a ceramic plate 26 which consists of a fluorin gold mica system ceramics with the Vickers hardness about 2200MPa, one side surface of a member for magnetic head to be a member being polished, consisting of a compound material is contacted and slid on the polishing surface 14, so as to polish the one side surface. Consequently, since the hardness of the polishing surface 14 is relatively low being about Hv=2200MPa, the abrasive particles 42 fed on the polishing surface 14 in the polishing process are buried in the polishing surface 14, and maintained in the condition making the heights of their edges even.
申请公布号 JPH09201761(A) 申请公布日期 1997.08.05
申请号 JP19960012716 申请日期 1996.01.29
申请人 NORITAKE CO LTD 发明人 YAMAGUCHI YUKIO;HAYASHI MINORU
分类号 B24B37/12;B24D3/00 主分类号 B24B37/12
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