| 摘要 |
<p>A thermocompression bonding device (1) comprises a thermocompression bonding head (10) whose body (13) includes a presser (130) having a margin (130a) coated with a ceramic layer (15) of a predetermined thickness. The thermal-expansion coefficients of the body (13) of the head and the ceramic layer (15) are different within 30 % from each other at temperature below 400 °C.</p> |
