发明名称 HANDOTAIPATSUKEEJI
摘要 A semiconductor device includes a base case 12, a first conductive pattern 6 selectively formed on the base case 12 a semiconductor element 1 mounted on the first pattern 6, a second conductive pattern 7 selectively formed on the base case 12 and connected to a first electrode 2 of the semiconductor element 1, the second conductive pattern 7 being separated from the first conductive pattern 6 to form a first parasitic capacitance therebetween, and a third conductive pattern 8 selectively formed on the base case 12 and connected to a second electrode 3 of the semiconductor element 1, the third conductive pattern 8 being separated from the first conductive pattern 6 to form a second parasitic capacitance therebetween, the first parasitic capacitance being larger than the second parasitic capacitance.
申请公布号 JP2638514(B2) 申请公布日期 1997.08.06
申请号 JP19940277456 申请日期 1994.11.11
申请人 NIPPON DENKI KK 发明人 NEGISHI HITOSHI
分类号 H01L23/12;H01L21/338;H01L23/02;H01L23/04;H01L23/66;H01L29/812 主分类号 H01L23/12
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