发明名称 POLYIMIDE COMPOSITE, VARNISH, FILM, METAL-CLAD LAMINATE, AND PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a polyimide composite having excellent adhesion, water resistance, or the like, without losing the heat resistance, electric insulation, mechanical characteristics, or the like of the polyimide resin itself, a varnish for forming the polyimide composite, and a film from the polyimide composite, and also both a metal-clad laminate and a printed wiring board which have excellent adhesion, electric insulation, and resistance to heat, chemicals, and water, and which can be molded in a mild condition. SOLUTION: The polyimide composite consists of (A) a polyimide component and (B) other polymer components, and has an elastic modulus of less than 10 GPa. A varnish is made from this polyimide composite, a film is similarly made from the polyimide composite, and a metal-clad laminate is made by forming a layer of the polyimide composite on a metal foil. Furthermore, a printed wiring board uses at least one layer of the metal-clad laminate.
申请公布号 JP2000044800(A) 申请公布日期 2000.02.15
申请号 JP19980219025 申请日期 1998.08.03
申请人 JSR CORP 发明人 GOTO HIROFUMI;ITO NOBUYUKI
分类号 C08J5/18;B32B15/08;B32B15/088;C08L79/08;C08L101/00;C09D179/08;C09D201/00;H05K1/03;(IPC1-7):C08L79/08 主分类号 C08J5/18
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