| 摘要 |
A test assembly (300) contains a plurality of electronic devices (210, 220) that are attached to a lead frame (200). Leads (212, 222) of the electronic devices (210, 220) are trimmed from the lead frame (200) to electrically isolate the leads (212, 222). At least a portion of the lead frame (200) is mounted into a socket (260, 262) in the test assembly (300).
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