发明名称 APPARATUS FOR SPRAY-COOLING MULTIPLE ELECTRONIC MODULES
摘要 <p>The apparatus (70) includes a substantially planar plate (72) having a first side (74) and a second side (76). A plurality of substantially planar fluid distributing manifolds (82) are formed in the first side of the plate, each fluid distributing manifold having a surface (84) recessed relative to at least a portion of the first side of the plate. A nozzle housing (86) is located in the surface of each fluid distributing manifold. The nozzle housing is adapted to receive a nozzle and has a receptacle end (88) and a spray end (70). The spray end has an aperture (92), and is in communication with the second side of the plate. The receptacle end is in communication with the surface of one of the plurality of fluid distributing manifolds.</p>
申请公布号 WO1997028674(A1) 申请公布日期 1997.08.07
申请号 US1996019017 申请日期 1996.11.26
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