发明名称 SOLID STATE IMAGING ELEMENT AND MANUFACTURE THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a solid state imaging element and the manufacture thereof whereby the sensitivity to long wavelength lights such as infrared rays can be improved and the dark current is low. SOLUTION: A solid state imaging element has an overflow barrier 12 beneath a sensor having a depletion layer length L1 longer at the center than the depletion layer length L2 at the periphery. A solid state imaging element has a sensor having a second conductivity type semiconductor region 13 formed on the surface of a first conductivity type semiconductor region 12, wherein a second conductivity type semiconductor layer 6 having a less than that of the semiconductor region 13 is formed in the semiconductor region 12 beneath the semiconductor region 13. A solid state imaging element is manufactured in a process having a step of introducing a second conductivity type impurity into a region having a less area than the second conductivity type semiconductor region 13 in the first conductivity type semiconductor region 12 beneath the second conductivity type semiconductor region 13.
申请公布号 JP2000357788(A) 申请公布日期 2000.12.26
申请号 JP19990167022 申请日期 1999.06.14
申请人 SONY CORP 发明人 HASEGAWA KENJI
分类号 H01L27/148;H01L31/10;H04N5/335;H04N5/369;H04N5/372;(IPC1-7):H01L27/148 主分类号 H01L27/148
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