发明名称 THERMOSETTING ADHESIVE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To obtain a thermosetting adhesive composition giving excellent adhesive strength (shear strength) in the case of using an inorganic material (especially a metallic inorganic material such as steel plate) as the adherend. SOLUTION: The thermosetting adhesive composition contains an oxetane compound, a coupling agent and a photo-thermal polymerization initiator.
申请公布号 JP2001323244(A) 申请公布日期 2001.11.22
申请号 JP20000143309 申请日期 2000.05.16
申请人 UBE IND LTD 发明人 MIWA YOSHIYUKI;KUNIMURA MASARU
分类号 C09J171/02;C09J163/00;C09J183/04;(IPC1-7):C09J171/02 主分类号 C09J171/02
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