发明名称 |
THERMOSETTING ADHESIVE COMPOSITION |
摘要 |
PROBLEM TO BE SOLVED: To obtain a thermosetting adhesive composition giving excellent adhesive strength (shear strength) in the case of using an inorganic material (especially a metallic inorganic material such as steel plate) as the adherend. SOLUTION: The thermosetting adhesive composition contains an oxetane compound, a coupling agent and a photo-thermal polymerization initiator.
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申请公布号 |
JP2001323244(A) |
申请公布日期 |
2001.11.22 |
申请号 |
JP20000143309 |
申请日期 |
2000.05.16 |
申请人 |
UBE IND LTD |
发明人 |
MIWA YOSHIYUKI;KUNIMURA MASARU |
分类号 |
C09J171/02;C09J163/00;C09J183/04;(IPC1-7):C09J171/02 |
主分类号 |
C09J171/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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