发明名称 COMPONENT MOUNTING METHOD, SUCTION NOZZLE AND COMPONENT MOUNTING EQUIPMENT SUITABLY USED THEREFOR
摘要 PROBLEM TO BE SOLVED: To obtain a component mounting method, a suction nozzle and component mounting equipment which are suitably used for the method wherein suction is enabled without causing deformation of the shape and damage to it even if a component is very thin, and fixing to a substrate is enabled simultaneously with mounting on the substrate, by spreading a part to be sucked from pointwise to line type and from line type to surface type, corresponding to the thickness of the component to be mounted and/or the area of the surface to be sucked, and dispersing a suction force as widely and uniformly as possible. SOLUTION: In the suction nozzle 1A, a suction aperture 60A is formed in a slit type. Embodiments of suction nozzles wherein suction apertures are constituted of a plurality of suction slits are enumerated. Figures 1, 2 show a suction nozzle 5A whose suction aperture 60A is a cross type, a figure 3 shows a suction nozzle 5B whose suction aperture 60B is X-shaped, and a figure 4 shows a suction nozzle 5C having a suction aperture 60C wherein a plurality of suction slits are arranged in parallel to each other. The suction nozzle 5A is connected with heating equipment 7. A suction nozzle wherein opening and closing valves 63A, 63B are installed on a suction slit 60 is also shown.
申请公布号 JP2002158496(A) 申请公布日期 2002.05.31
申请号 JP20000351352 申请日期 2000.11.17
申请人 SONY CORP 发明人 YASUDA MASAYUKI;HANAI NOBUHIRO;HONDA NORIYUKI;MURAYAMA TOSHIHIRO
分类号 B25J15/00;B25J15/06;H01L21/52;H01L21/60;H05K13/04 主分类号 B25J15/00
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