METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing semiconductor device which can safely manufacture a high precision circuit wiring without corrosion of a metal film such as an aluminum-based conductive film. SOLUTION: When a photoresist formed on a substrate is peeled, the substrate is cleaned with a rinse agent comprising a water including carbon oxide gas after the photoresist is peeled by a basic peeling liquid.