| 摘要 |
PURPOSE:To provide excellent durability and to prevent a danger of peeling of a slide pattern by forming by printing the pattern on a mirror-face pate, connecting electronic components, then resin-sealing the connecting side of the component of the plate, and peeling the sealing resin from the plate. CONSTITUTION:After a slide pattern 2 and a circuit pattern 3 are printed on a mirror-face plate 6 and baked, electronic components 4 and a terminal 5 are disposed at predetermined positions, and soldered. The connecting side of the components 4 of the plate 6 is resin-sealed except the terminal 5 by transfer molding metal die, thereby forming a resin package 1. The pattern 2 and the package 1 for sealing the components 4 and the like are peeled off from the plate 6. The peeling method includes coating the plate 6 with a mold release agent before the patterns 2 and 3 are printed, or dipping the package 1 and the plate 6 of hot state immediately after the resin molding is finished in a low temperature liquid tank to quickly cool it. |
