| 摘要 |
The invention concerns a semiconductor component produced by the LOC (lead on chip) technique. The connection fingers (16) extending over the upper side (14) of the chip are bonded thereto in a bond pattern (points of adhesive (26)) which is adapted to the position of the connection fingers (16) such that only a small area of the upper side (14) of the chip is covered with adhesive. The semiconductor components according to the invention can be manufactured easily and also produced in a TSOP structure. |
