| 摘要 |
A package structure of an LED(Light Emitting Diode) and a method for manufacturing the same are provided to simplify manufacturing processes and to improve a heat radiation efficiency by forming a heat radiating part, an auxiliary support part, an auxiliary lead and a main lead as one piece using conductive metal. A package structure of an LED includes first and second auxiliary support parts, a heat radiating part, a plurality of auxiliary leads, and a main lead. The first and second auxiliary support parts(121,122) are formed like a plate type structure. The first and second auxiliary support parts have a first thickness, respectively. The heat radiating part(110) is formed at a portion between the first and second auxiliary support parts to mount an LED chip. The heat radiating part has a second thickness larger than the first thickness. The plurality of auxiliary leads(141,142) the same thickness as that of the auxiliary support part. The auxiliary lead is used for connecting the auxiliary support part with a lateral of the heat radiating part. The main lead(131,132) the same thickness as that of the auxiliary support part. The main lead is spaced apart from the heat radiating part. The heat radiating part, the auxiliary support part, the auxiliary lead and the main lead are formed as one piece by using conductive metal.
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