| 摘要 |
Manufacturing method and a multi-chip package, which comprises a conductor pattern (1) and insulation (2), and, inside the insulation, a first component (3), the contact terminals (4) of which face towards the conductor pattern (1) and are conductively connected to the conductor pattern (1). The multi-chip package also comprises inside the insulation (2) a second semiconductor chip (13), the contact terminals (14) of which face towards the same conductor pattern (1) and are conductively connected through contact elements (15) to this conductor pattern (1). The semiconductor chips are located in such a way that the first semiconductor chip (3) is located between the second semiconductor chip (13) and the conductor pattern (1). |
