发明名称 HEATING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a heating apparatus capable of efficiently removing vaporized substance evaporated by heating and capable of preventing adverse effect on a substrate. SOLUTION: The heating apparatus 1 is configured in such a manner that hot air H is jetted by a plurality of heating blowers to a substrate W transported by a conveyor 65 to heat and fuse solder components on the substrate W thereby soldering is performed, and that the jetted hot air h is collected and returned. Further, between the heating blower 10c on a low temperature side and the heating blower 10 on a high temperature side among the plurality of heating blowers, there are stretched a first connecting body 4 and a second connecting body 5. In the first connecting body 4, a catalyst is provided that thermally decomposes a flux fume delivered together with the hot air from the heating blowers 10c. In the second connecting body 5, a vaporized substance cooling/collecting mechanism is installed that cools to liquefy and recover the flux fume delivered together with the hot air from the heating blowers 10. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008221329(A) 申请公布日期 2008.09.25
申请号 JP20070067625 申请日期 2007.03.15
申请人 TAMURA SEISAKUSHO CO LTD 发明人 FURUNO MASAHIKO
分类号 B23K1/008;B23K1/012;F27B9/10;F27D7/02;H05K3/34 主分类号 B23K1/008
代理机构 代理人
主权项
地址