发明名称 adesivo termofundível sob baixa temperatura de aplicação
摘要 High temperature performance hot melt adhesives are formulated for application at low temperature, i.e., below 300° F. Hot melt adhesive formed with metallocene polymer together with a maleated polyethylene wax show an excellent balance of high and low temperature performance and are particularly useful as packaging case and carton adhesive.
申请公布号 BR112012002264(A2) 申请公布日期 2016.06.14
申请号 BR20121102264 申请日期 2010.07.30
申请人 HENKEL CORPORATION 发明人 ANDREA KEYS EODICE;JAGRUTI B. PATEL;YEW GUAN LOW
分类号 C09J5/06;C09J123/08;C09J123/20;C09J191/06 主分类号 C09J5/06
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