发明名称 |
adesivo termofundível sob baixa temperatura de aplicação |
摘要 |
High temperature performance hot melt adhesives are formulated for application at low temperature, i.e., below 300° F. Hot melt adhesive formed with metallocene polymer together with a maleated polyethylene wax show an excellent balance of high and low temperature performance and are particularly useful as packaging case and carton adhesive. |
申请公布号 |
BR112012002264(A2) |
申请公布日期 |
2016.06.14 |
申请号 |
BR20121102264 |
申请日期 |
2010.07.30 |
申请人 |
HENKEL CORPORATION |
发明人 |
ANDREA KEYS EODICE;JAGRUTI B. PATEL;YEW GUAN LOW |
分类号 |
C09J5/06;C09J123/08;C09J123/20;C09J191/06 |
主分类号 |
C09J5/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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