发明名称 SUBSTRATE HOLDING MECHANISM AND SUBSTRATE PROCESSING DEVICE EMPLOYING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a substrate holding mechanism capable of holding a substrate by surely preventing the substrate from being floated in the state where a substrate surface is exposed completely, and a substrate processing device employing the same.SOLUTION: A substrate holding mechanism 120 configured to hold the substrate on a predetermined substrate holding region 25 on a susceptor 2 comprises: a substrate holding member 80 which is provided around the substrate holding region and is rotated from the outside of the substrate holding region to the inside to be in contact with a side face part of the substrate that is mounted on the substrate holding region, on a predetermined contact surface 80a; energization means 90 that applies an inward energization force capable of holding the substrate by being in contact with the side face part of the substrate, to the substrate holding member; and an opening member 100 capable of opening the substrate holding member into a state where the substrate can be carried up in a vertical direction, by applying a force against the energization force of the energization means, to the substrate holding member.SELECTED DRAWING: Figure 8
申请公布号 JP2016152264(A) 申请公布日期 2016.08.22
申请号 JP20150027717 申请日期 2015.02.16
申请人 TOKYO ELECTRON LTD 发明人 KATO HISASHI
分类号 H01L21/31;B65G49/07;C23C16/458;H01L21/683 主分类号 H01L21/31
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