| 摘要 |
PROBLEM TO BE SOLVED: To provide a sputtering target capable of preventing coarse clusters, such as particles, splashes and dust from occurring when a target is sputtered to improve the thickness uniformity of a thin film formed by sputtering.SOLUTION: The sputtering target using copper having a purity of 99.9 mass% or more as a principal component includes 10 ppm or less of sulfur (S) and 2 ppm or less lead (Pb). The purity of the copper is preferably 99.96 mass% or more.SELECTED DRAWING: Figure 1 |
