| 发明名称 |
CO-FINISHING SURFACES |
| 摘要 |
A method for co-finishing surfaces bonds a first structure formed of a first material and having a first surface in an aperture defined in a second structure formed of a second material and having a second surface such that there is an offset between the first surface and the second surface. The first surface and the second surface are co-lapped to reduce the offset. The first surface and second surface are co-polished to further reduce the offset. The first surface and second surfaces may then be flush. Edges of the first surface may be chamfered to mitigate damage during co-lapping and/or co-polishing. Fill material may be positioned in gaps between the first and second structures to mitigate damage during co-lapping and/or co-polishing. |
| 申请公布号 |
US2016256979(A1) |
申请公布日期 |
2016.09.08 |
| 申请号 |
US201514714876 |
申请日期 |
2015.05.18 |
| 申请人 |
Apple Inc. |
发明人 |
Matsuyuki Naoto;Yi Bin;Qu Dezheng;Manjunathaiah Jairam;Nathanson Scott M.;Ness Trevor J.;Nazzaro David I.;Molina Raul A. |
| 分类号 |
B24B37/04;B29C70/88;B29C65/50;C03C25/00;B29C70/74 |
主分类号 |
B24B37/04 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for co-finishing surfaces, comprising:
bonding a first structure formed of a first material and having a first non-planar surface in an aperture defined in a second structure formed of a second material and having a second planar surface such that there is an offset between the first surface and the second surface; co-lapping the first surface and the second surface to reduce the offset; and co-polishing the first surface and the second surface such that the first surface and the second surface are flush. |
| 地址 |
Cupertino CA US |
