Verfahren zum Herstellen eines Substrates für integrierte Mikrowellen-Schaltungen
摘要
A microwave integrated circuit formed on a substrate (22) comprising a body of insulating material having upper and lower surfaces with one or more holes (21) formed in said body to extend between the upper and lower surface and a metal filling said holes and extending between and coplanar with the upper and lower surfaces.
申请公布号
DE68927815(T2)
申请公布日期
1997.09.04
申请号
DE1989627815T
申请日期
1989.09.26
申请人
MICROWAVE POWER, INC., SANTA CLARA, CALIF., US
发明人
BUJATTI, MARINA, PALO ALTO CALIFORNIA 94301, US;SECHI, FRANCO NICOLA, PALO ALTO CALIFORNIA 94303, US