发明名称 |
MASK FOR LASER MACHINING AND ITS MANUFACTURE |
摘要 |
PROBLEM TO BE SOLVED: To provide a mask superior in the shape precision of perforation pattern as well as in the distribution of transmissivity and capable of being manufactured by dry etching. SOLUTION: An intermediate film for protecting a substrate 3 from being etched is formed between the substrate 3 with a characteristic of transmitting a laser beam for machining and a reflection film 2 with a characteristic of reflecting a laser beam. The intermediate film 1 is formed with a material whose etching rate is smaller than that of the substrate in the thickness direction in dry etching and also with a material that transmits a laser beam. The intermediate film 1 prevents etching from reaching the substrate 3 in the case where the reflection film 2 is machined in a desired pattern by dry etching. Consequently, it is capable of reducing the distribution of depth of a etched pattern in the main plane of the substrate. |
申请公布号 |
JPH09225669(A) |
申请公布日期 |
1997.09.02 |
申请号 |
JP19960038168 |
申请日期 |
1996.02.26 |
申请人 |
HITACHI LTD |
发明人 |
AMAMIYA KYOKO;TERABAYASHI TAKAO;SUZUKI KENKICHI |
分类号 |
G03F1/08;B23K26/06;C23F1/00;C23F4/04 |
主分类号 |
G03F1/08 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|