| 摘要 |
<p>1,263,126. Mounting semi-conductor devices. TEXAS INSTRUMENTS Inc. 19 Aug., 1969 [24 Oct., 1968], No. 41277/69. Headings H1K and H1R. For mounting, e.g. a miniaturized electronic circuit 22 on a printed circuit board 32 and making electrical connection between the circuit and board, insulating body 10 has pedestal members 18 extending downwardly from its lower surface, metallized zones 20 on its upper surface form leads for circuit 22 and conductive paths electrically connect leads 22 with metal films on the bottoms of the pedestal members. As shown, the sides of the pedestal members are metallized to form the conductive paths. Alternatively (Figs. 5 to 8, not shown) the conductive paths are formed by filling holes drilled through the pedestals with wire or molten metal. The pedestal members may have square or round cross-section and the bottoms may be rounded. The insulating body may be of plastics, glass or ceramic and the metallization may be applied by coating with Mo or Mn in a binder through a mask, firing and electroplating with layers of Ni, Ag and Au. A layer of Sn may be applied by hot dipping. The circuit 22 may be a single transistor or may contain active and passive components and may be encapsulated with epoxy resin after it has been connected to the metallized paths.</p> |
